Memory chip

4-Mbit (512K x8bit), SPI interface, working voltage: 2.7V to 3.6V

SD NAND generation, driver-free use, standard SDIO, compatible with SPI/SD/eMMC interface, compatible with major MCU platforms; built-in EDC/ECC, bad block management, garbage collection algorithm; can be machine-mounted, lock wafer and controller, consistent High performance; standard SD2.0 protocol, size 6.2x8mm, MLC architecture. \nCS (Creation) SD NAND is also called by many developers and friends: SMD TF card, SMD SD card, SMD card, soldered SD card, soldered TF card, new NAND FLASH, industrial grade TF card, industrial grade SD card, embedded SD card, etc. It mainly solves the problem that the main control (such as STM32 series MCU MCU) needs to manage NAND FLASH by itself when using SLC NAND FLASH, SPI NAND FLASH, eMMC, etc. CS (Genesis) SD NAND can be used without drivers (so it is also called no need to write drivers NAND Flash). Compared with eMMC, CS (Genesis) SD NAND has fewer pins (convenient for soldering); smaller capacity (can help customers reduce costs); longer erasing life; smaller size (occupies only 1/3 of eMMC PCB area) ); save the number of PCB board layers (2-layer board can be used)

256-Kbit(32K x 8bit), I2C interface, 1.7V to 5.5V, -40~+85℃

MMC eMMC 32GB TLC Industrial -25~85℃, application fields: industrial control, automotive electronics, medical